DSG Series

THERMAL GEL MATERIALS

Thermal Gel

A liquid thermal interface material precisely dispensed into gaps through automated dispensing processes. After cure, it forms an elastic, thermally conductive gap-filling layer for thermal management in inverters, energy storage battery systems, EV charging equipment, and other new energy applications.

DSG Series Thermal Gel

Precision Dispensing · Elastic Gap Fill · Long-Term Reliability

ONE-COMPONENT · DSG1 SERIES

One-Component Thermal Gel DSG1 Series

A one-part, no-mix liquid thermal interface material that cures with ambient moisture to form a soft, conformable gap-filling layer. Designed for automated dispensing, it provides efficient thermal management and protection for precision electronic components.

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DSG1 One-Component Thermal Gel

DSG1 One-Component Thermal Gel · Ready to Use · Moisture Cure

Key Parameters Parameters
Thermal Conductivity
4.0–12.0 W/m·K
Dispensing Rate
5–10 or higher g/min
Oil Bleed (Migration)
≤ 10-4 mm
Volume Resistivity
1×1012–1×1013 Ω·cm
Operating Temperature
-40 ~ 125 °C
Cure Mechanism
Moisture Cure
Key Properties
  • Ready to use
  • Medium-to-high thermal conductivity
  • Thixotropic design
  • Forms an elastomer after cure
  • Excellent electrical insulation
  • Excellent weatherability and long-term stability
Material Advantages Advantages
Sag-Resistant High Flow Rate Low Volatility Low Oil Bleed

APPLICATION SCENARIOS · DSG1

DSG1 Application Scenarios

DSG1 one-component thermal gel is widely used in PV inverters, energy storage systems, and power modules for precision dispensing and efficient interfacial heat transfer.

Inverters

Thermal gap filling between chips, IGBT modules, and heat sinks to support safe operation of core power components.

Energy Storage Battery Thermal Management

Thermal interface between cells, between cells and cold plates, while also supporting heat dissipation for control units.

Converters and Power Modules

Thermal protection for power units and core components, improving thermal stability and overall equipment reliability.

Thermal management inside PV optimizers

Thermal Management Inside PV Optimizers

PV Optimizer

Thermal management inside PCS units

Thermal Management Inside PCS Units

Power Conversion System

TWO-COMPONENT · DSG2 SERIES

Two-Component Thermal Gel DSG2 Series

A two-part liquid TIM that cures into an elastomer after components A and B are mixed. It supports deep-section fast cure and automated dispensing while delivering strong adhesion, dimensional stability, and efficient heat transfer.

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DSG2 Two-Component Thermal Gel

DSG2 Two-Component Thermal Gel · A:B = 1:1 · Deep-Section Cure

Key Parameters Parameters
Thermal Conductivity
2.0–8.0 W/m·K
Mix Ratio
1:1 (A:B)
Tack-Free Time
1–2 h (adjustable)
Full Cure Time
6–8 h (adjustable)
Hardness (After Cure)
Shore 00 40–70
Volume Resistivity
1×1012–1×1013 Ω·cm
Operating Temperature
-40 ~ 150 °C
Cured Form
Elastomer
Key Properties
  • High thermal conductivity
  • Excellent thixotropy and flowability
  • Forms an elastomer after cure
  • Excellent electrical insulation
  • Ultra-low low-molecular-weight volatiles
  • Flame retardant
Material Advantages Advantages
Easy Reworkability Crack-Resistant High Reliability Sag-Resistant Low Volatility

APPLICATION SCENARIOS · DSG2

DSG2 Application Scenarios

With deep-section cure capability and bonding performance, DSG2 two-component thermal gel is designed for demanding applications such as battery fixation, deep-cavity IGBT potting, and large-gap automated dispensing.

Battery Bonding and Fixation

Cell-to-liquid cooling plate bonding and cell-to-cell thermally conductive structural bonding provide both heat transfer and mechanical fixation for higher module reliability.

Deep-Cavity Potting

Deep-cavity filling for IGBT modules provides thermal management in structures where light-curing materials cannot reach, helping ensure long-term reliability of power devices.

Large-Gap Automated Dispensing

Thermal and sealing protection for cable pass-throughs and joints in hybrid PV-plus-storage units, suitable for large gaps and irregular cavities.

Bonding between cells and liquid cooling plates

Bonding Between Cells and Liquid Cooling Plates

Energy Storage

Deep-cavity thermal management in energy storage applications

Thermally Conductive Bonding in Energy Storage Packs

Energy Storage

Partner with Desunergy to Advance Thermal Interface Innovation

Whether you are an inverter manufacturer, an energy storage system integrator, or a partner seeking high-reliability thermal management materials, our team is ready to support you with tailored solutions.

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